SP8680BDG
vs
11C90DC
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
ZARLINK SEMICONDUCTOR INC
|
NATIONAL SEMICONDUCTOR CORP
|
| Part Package Code |
DIP
|
|
| Package Description |
DIP,
|
DIP, DIP16,.3
|
| Pin Count |
16
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Additional Feature |
+5V TTL OPERATION ALSO
|
+5V TTL OPERATION ALSO
|
| Family |
8680
|
ECL
|
| JESD-30 Code |
R-GDIP-T16
|
R-GDIP-T16
|
| JESD-609 Code |
e0
|
e0
|
| Logic IC Type |
PRESCALER
|
PRESCALER
|
| Number of Data/Clock Inputs |
1
|
1
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
16
|
16
|
| Operating Temperature-Max |
85 °C
|
75 °C
|
| Operating Temperature-Min |
-40 °C
|
|
| Output Polarity |
COMPLEMENTARY
|
COMPLEMENTARY
|
| Package Body Material |
CERAMIC, GLASS-SEALED
|
CERAMIC, GLASS-SEALED
|
| Package Code |
DIP
|
DIP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
5.08 mm
|
5.08 mm
|
| Surface Mount |
NO
|
NO
|
| Temperature Grade |
INDUSTRIAL
|
COMMERCIAL EXTENDED
|
| Terminal Finish |
TIN LEAD
|
TIN LEAD
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
7.62 mm
|
7.62 mm
|
| fmax-Min |
575 MHz
|
575 MHz
|
| Base Number Matches |
1
|
2
|
| Length |
|
19.43 mm
|
| Load Capacitance (CL) |
|
5 pF
|
| Max Frequency@Nom-Sup |
|
575000000 Hz
|
| Output Characteristics |
|
OPEN-EMITTER
|
| Package Equivalence Code |
|
DIP16,.3
|
| Power Supply Current-Max (ICC) |
|
119 mA
|
| Propagation Delay (tpd) |
|
3 ns
|
| Technology |
|
BIPOLAR
|
|
|
|
Compare SP8680BDG with alternatives
Compare 11C90DC with alternatives