SP706CU
vs
FM810LS3X
feature comparison
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
SIPEX CORP
|
ROCHESTER ELECTRONICS INC
|
| Package Description |
TSSOP, TSSOP8,.19
|
TSSOP,
|
| Reach Compliance Code |
unknown
|
unknown
|
| Additional Feature |
BAT BUP SW:N;MNL RST:Y;OV DET:N;PW FL IP:N;PW FL IO:N;PW FL OP:N;PRG RST DLY:N;UV DET:N;WD:N;WWD:N
|
|
| Adjustable Threshold |
NO
|
NO
|
| Analog IC - Other Type |
VOLTAGE SUPERVISOR/RESET IC
|
POWER SUPPLY SUPPORT CIRCUIT
|
| JESD-30 Code |
R-PDSO-G8
|
R-PDSO-G3
|
| JESD-609 Code |
e0
|
e3
|
| Length |
2.9972 mm
|
2.9 mm
|
| Moisture Sensitivity Level |
1
|
NOT SPECIFIED
|
| Number of Channels |
1
|
1
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
8
|
3
|
| Operating Temperature-Max |
70 °C
|
105 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TSSOP
|
TSSOP
|
| Package Equivalence Code |
TSSOP8,.19
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Peak Reflow Temperature (Cel) |
240
|
NOT SPECIFIED
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
1.0922 mm
|
1.14 mm
|
| Supply Current-Max (Isup) |
0.06 mA
|
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
1 V
|
1 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
|
| Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
| Terminal Finish |
TIN LEAD
|
TIN
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.65 mm
|
0.95 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Threshold Voltage-Nom |
+4.4V
|
|
| Width |
3 mm
|
1.3 mm
|
| Base Number Matches |
1
|
2
|
| Pbfree Code |
|
Yes
|
| Part Package Code |
|
SOT-23
|
| Pin Count |
|
3
|
| Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
|
|
|
Compare SP706CU with alternatives
Compare FM810LS3X with alternatives