SP6651AER-L/TR
vs
TPS62000YEGR
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
SIPEX CORP
|
TEXAS INSTRUMENTS INC
|
| Package Description |
3 X 3 MM, LEAD FREE, MO-229-VEED, DFN-10
|
DSBGA-12
|
| Reach Compliance Code |
unknown
|
unknown
|
| Analog IC - Other Type |
SWITCHING REGULATOR
|
SWITCHING REGULATOR
|
| Control Technique |
PULSE WIDTH MODULATION
|
PULSE WIDTH MODULATION
|
| Input Voltage-Max |
5.5 V
|
5.5 V
|
| Input Voltage-Min |
2.7 V
|
2 V
|
| Input Voltage-Nom |
3.6 V
|
3.6 V
|
| JESD-30 Code |
S-PDSO-N10
|
R-XBGA-B12
|
| JESD-609 Code |
e3
|
|
| Length |
3 mm
|
2.25 mm
|
| Moisture Sensitivity Level |
1
|
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
10
|
12
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Current-Max |
2 A
|
1.6 A
|
| Package Body Material |
PLASTIC/EPOXY
|
UNSPECIFIED
|
| Package Code |
HVSSON
|
VFBGA
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE, SHRINK PITCH
|
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
| Peak Reflow Temperature (Cel) |
260
|
NOT SPECIFIED
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1 mm
|
0.625 mm
|
| Surface Mount |
YES
|
YES
|
| Switcher Configuration |
BUCK
|
BUCK
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
Matte Tin (Sn)
|
|
| Terminal Form |
NO LEAD
|
BALL
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
DUAL
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
NOT SPECIFIED
|
| Width |
3 mm
|
1.75 mm
|
| Base Number Matches |
2
|
1
|
| Part Package Code |
|
BGA
|
| Pin Count |
|
12
|
| ECCN Code |
|
EAR99
|
| HTS Code |
|
8542.39.00.01
|
| Additional Feature |
|
PFM CONTROL TECHNIQUE IS ALSO POSSIBLE
|
| Control Mode |
|
CURRENT-MODE
|
| Package Equivalence Code |
|
BGA12,3X4,20
|
| Switching Frequency-Max |
|
1000 kHz
|
| Technology |
|
MOS
|
|
|
|
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