SP3222EHEY
vs
MAX3232ECUE+
feature comparison
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
SIPEX CORP
|
ANALOG DEVICES INC
|
| Package Description |
TSSOP, TSSOP20,.25
|
|
| Reach Compliance Code |
unknown
|
compliant
|
| Differential Output |
NO
|
NO
|
| Driver Number of Bits |
2
|
2
|
| Input Characteristics |
STANDARD
|
SCHMITT TRIGGER
|
| Interface IC Type |
LINE TRANSCEIVER
|
LINE TRANSCEIVER
|
| Interface Standard |
EIA-232-F; TIA-232-F; V.24; V.28
|
EIA-232; TIA-232; V.24; V.28
|
| JESD-30 Code |
R-PDSO-G20
|
R-PDSO-G16
|
| JESD-609 Code |
e0
|
e3
|
| Length |
6.5 mm
|
5 mm
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Functions |
2
|
2
|
| Number of Terminals |
20
|
16
|
| Operating Temperature-Max |
85 °C
|
70 °C
|
| Operating Temperature-Min |
-40 °C
|
|
| Out Swing-Min |
10 V
|
10 V
|
| Output Low Current-Max |
0.0016 A
|
0.0016 A
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TSSOP
|
TSSOP
|
| Package Equivalence Code |
TSSOP20,.25
|
TSSOP16,.25
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Peak Reflow Temperature (Cel) |
240
|
260
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Receive Delay-Max |
|
|
| Receiver Number of Bits |
2
|
2
|
| Seated Height-Max |
1.1 mm
|
1.1 mm
|
| Supply Current-Max |
1 mA
|
1 mA
|
| Supply Voltage-Max |
5 V
|
5.5 V
|
| Supply Voltage-Min |
3 V
|
3 V
|
| Supply Voltage-Nom |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
| Terminal Finish |
TIN LEAD
|
Matte Tin (Sn)
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.65 mm
|
0.65 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
4.4 mm
|
4.4 mm
|
| Base Number Matches |
4
|
2
|
| Part Package Code |
|
16-TSSOP_4.4-4.4_MM
|
| Pin Count |
|
16
|
| Manufacturer Package Code |
|
16-TSSOP_4.4-4.4_MM
|
| Date Of Intro |
|
2002-03-29
|
| Samacsys Manufacturer |
|
Analog Devices
|
| Technology |
|
BICMOS
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare SP3222EHEY with alternatives
Compare MAX3232ECUE+ with alternatives