SN75174N
vs
5962-7802001MFA
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
MOTOROLA SEMICONDUCTOR PRODUCTS
|
PHILIPS SEMICONDUCTORS
|
| Package Description |
DIP, DIP16,.3
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| Differential Output |
YES
|
|
| Driver Number of Bits |
4
|
|
| High Level Input Current-Max |
0.00002 A
|
|
| JESD-30 Code |
R-PDIP-T16
|
R-XDFP-F16
|
| JESD-609 Code |
e0
|
e0
|
| Number of Terminals |
16
|
16
|
| Operating Temperature-Max |
70 °C
|
125 °C
|
| Operating Temperature-Min |
|
-55 °C
|
| Out Swing-Min |
1.5 V
|
|
| Output Characteristics |
3-STATE
|
|
| Package Body Material |
PLASTIC/EPOXY
|
CERAMIC
|
| Package Code |
DIP
|
DFP
|
| Package Equivalence Code |
DIP16,.3
|
FL16,.3
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
FLATPACK
|
| Power Supplies |
5 V
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
NO
|
YES
|
| Technology |
BIPOLAR
|
TTL
|
| Temperature Grade |
COMMERCIAL
|
MILITARY
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
Tin/Lead (Sn/Pb) - hot dipped
|
| Terminal Form |
THROUGH-HOLE
|
FLAT
|
| Terminal Pitch |
2.54 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Transmit Delay-Max |
25 ns
|
|
| Base Number Matches |
4
|
9
|
| ECCN Code |
|
EAR99
|
| HTS Code |
|
8542.39.00.01
|
| Interface IC Type |
|
LINE RECEIVER
|
| Output Low Current-Max |
|
0.008 A
|
| Receive Delay-Max |
|
38 ns
|
| Screening Level |
|
38535Q/M;38534H;883B
|
| Supply Current-Max |
|
70 mA
|
|
|
|