SN74SSTL32867GKER
vs
IDT74SSTVN16859NLG8
feature comparison
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
INTEGRATED DEVICE TECHNOLOGY INC
|
Part Package Code |
BGA
|
QFN
|
Package Description |
LFBGA,
|
GREEN, PLASTIC, VFQFN-56
|
Pin Count |
96
|
56
|
Reach Compliance Code |
unknown
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Family |
SSTL
|
SSTV
|
JESD-30 Code |
R-PBGA-B96
|
S-PQCC-N56
|
Length |
13.5 mm
|
8 mm
|
Logic IC Type |
D FLIP-FLOP
|
D FLIP-FLOP
|
Number of Bits |
26
|
13
|
Number of Functions |
1
|
1
|
Number of Terminals |
96
|
56
|
Operating Temperature-Max |
70 °C
|
70 °C
|
Operating Temperature-Min |
|
|
Output Polarity |
TRUE
|
TRUE
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
LFBGA
|
VQCCN
|
Package Shape |
RECTANGULAR
|
SQUARE
|
Package Style |
GRID ARRAY, LOW PROFILE, FINE PITCH
|
CHIP CARRIER, VERY THIN PROFILE
|
Propagation Delay (tpd) |
3.8 ns
|
2.5 ns
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.4 mm
|
1 mm
|
Supply Voltage-Max (Vsup) |
2.7 V
|
2.7 V
|
Supply Voltage-Min (Vsup) |
2.3 V
|
2.3 V
|
Supply Voltage-Nom (Vsup) |
2.5 V
|
2.5 V
|
Surface Mount |
YES
|
YES
|
Technology |
TTL
|
TTL
|
Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
Terminal Form |
BALL
|
NO LEAD
|
Terminal Pitch |
0.8 mm
|
0.5 mm
|
Terminal Position |
BOTTOM
|
QUAD
|
Trigger Type |
POSITIVE EDGE
|
POSITIVE EDGE
|
Width |
5.5 mm
|
8 mm
|
Base Number Matches |
1
|
1
|
Rohs Code |
|
Yes
|
Additional Feature |
|
220 MHZ FOR PC3200 OPERATION
|
JESD-609 Code |
|
e3
|
Moisture Sensitivity Level |
|
3
|
Package Equivalence Code |
|
LCC56,.31SQ,20
|
Peak Reflow Temperature (Cel) |
|
260
|
Terminal Finish |
|
Matte Tin (Sn) - annealed
|
Time@Peak Reflow Temperature-Max (s) |
|
30
|
fmax-Min |
|
200 MHz
|
|
|
|
Compare SN74SSTL32867GKER with alternatives
Compare IDT74SSTVN16859NLG8 with alternatives