SN74SSTL32867GKER
vs
ICSSSTVA16859YKLF-T
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
TEXAS INSTRUMENTS INC
INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code
BGA
DFN
Package Description
LFBGA,
MLF2-56
Pin Count
96
56
Reach Compliance Code
unknown
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Family
SSTL
SSTV
JESD-30 Code
R-PBGA-B96
S-XQCC-N56
Length
13.5 mm
8 mm
Logic IC Type
D FLIP-FLOP
D FLIP-FLOP
Number of Bits
26
13
Number of Functions
1
1
Number of Terminals
96
56
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Output Polarity
TRUE
TRUE
Package Body Material
PLASTIC/EPOXY
UNSPECIFIED
Package Code
LFBGA
HVQCCN
Package Shape
RECTANGULAR
SQUARE
Package Style
GRID ARRAY, LOW PROFILE, FINE PITCH
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Propagation Delay (tpd)
3.8 ns
2.6 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.4 mm
1 mm
Supply Voltage-Max (Vsup)
2.7 V
2.7 V
Supply Voltage-Min (Vsup)
2.3 V
2.3 V
Supply Voltage-Nom (Vsup)
2.5 V
2.5 V
Surface Mount
YES
YES
Technology
TTL
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Form
BALL
NO LEAD
Terminal Pitch
0.8 mm
0.5 mm
Terminal Position
BOTTOM
QUAD
Trigger Type
POSITIVE EDGE
POSITIVE EDGE
Width
5.5 mm
8 mm
Base Number Matches
1
2
Pbfree Code
Rohs Code
Manufacturer Package Code
MLF
JESD-609 Code
e3
Package Equivalence Code
LCC56,.31SQ,20
Terminal Finish
MATTE TIN
fmax-Min
210 MHz
Compare SN74SSTL32867GKER with alternatives
Compare ICSSSTVA16859YKLF-T with alternatives