SN74S00FN
vs
5962-9162701MCX
feature comparison
| Part Life Cycle Code |
Contact Manufacturer
|
Active
|
| Ihs Manufacturer |
ROCHESTER ELECTRONICS LLC
|
TEXAS INSTRUMENTS INC
|
| Package Description |
QCCJ,
|
DIP,
|
| Reach Compliance Code |
unknown
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Family |
S
|
AS
|
| JESD-30 Code |
S-PQCC-J20
|
R-GDIP-T14
|
| JESD-609 Code |
e0
|
|
| Length |
8.9662 mm
|
19.56 mm
|
| Logic IC Type |
NAND GATE
|
NAND GATE
|
| Number of Functions |
4
|
4
|
| Number of Inputs |
2
|
2
|
| Number of Terminals |
20
|
14
|
| Operating Temperature-Max |
70 °C
|
125 °C
|
| Operating Temperature-Min |
|
-55 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, GLASS-SEALED
|
| Package Code |
QCCJ
|
DIP
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
CHIP CARRIER
|
IN-LINE
|
| Propagation Delay (tpd) |
5 ns
|
5 ns
|
| Seated Height-Max |
4.57 mm
|
5.08 mm
|
| Supply Voltage-Max (Vsup) |
5.25 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
4.75 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
NO
|
| Technology |
TTL
|
TTL
|
| Temperature Grade |
COMMERCIAL
|
MILITARY
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
J BEND
|
THROUGH-HOLE
|
| Terminal Pitch |
1.27 mm
|
2.54 mm
|
| Terminal Position |
QUAD
|
DUAL
|
| Width |
8.966 mm
|
7.62 mm
|
| Base Number Matches |
2
|
1
|
| Part Package Code |
|
DIP
|
| Pin Count |
|
14
|
| Load Capacitance (CL) |
|
50 pF
|
| Max I(ol) |
|
0.04 A
|
| Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
| Power Supply Current-Max (ICC) |
|
19 mA
|
| Prop. Delay@Nom-Sup |
|
5 ns
|
| Qualification Status |
|
Not Qualified
|
| Schmitt Trigger |
|
NO
|
| Screening Level |
|
MIL-STD-883
|
| Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
|
|
|
Compare SN74S00FN with alternatives
Compare 5962-9162701MCX with alternatives