SN74LVTH32244GKER
vs
IDT74LVCH162244APF8
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
TEXAS INSTRUMENTS INC
INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code
BGA
SOIC
Package Description
LFBGA-96
TSSOP, TSSOP48,.25,16
Pin Count
96
48
Reach Compliance Code
not_compliant
not_compliant
ECCN Code
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Control Type
ENABLE LOW
ENABLE LOW
Count Direction
UNIDIRECTIONAL
Family
LVT
LVC/LCX/Z
JESD-30 Code
R-PBGA-B96
R-PDSO-G48
JESD-609 Code
e0
e0
Length
13.5 mm
9.7 mm
Load Capacitance (CL)
50 pF
50 pF
Logic IC Type
BUS DRIVER
BUS DRIVER
Max I(ol)
0.064 A
0.012 A
Moisture Sensitivity Level
2
Number of Bits
4
4
Number of Functions
8
4
Number of Ports
2
2
Number of Terminals
96
48
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Characteristics
3-STATE
3-STATE WITH SERIES RESISTOR
Output Polarity
TRUE
TRUE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LFBGA
TSSOP
Package Equivalence Code
BGA96,6X16,32
TSSOP48,.25,16
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, LOW PROFILE, FINE PITCH
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Packing Method
TR
TR
Peak Reflow Temperature (Cel)
235
Power Supply Current-Max (ICC)
10 mA
Prop. Delay@Nom-Sup
3.2 ns
4.4 ns
Propagation Delay (tpd)
3.7 ns
5.6 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.4 mm
1.2 mm
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
2.7 V
2.7 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
BICMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
BALL
GULL WING
Terminal Pitch
0.8 mm
0.4 mm
Terminal Position
BOTTOM
DUAL
Time@Peak Reflow Temperature-Max (s)
20
Width
5.5 mm
4.4 mm
Base Number Matches
1
1
Compare SN74LVTH32244GKER with alternatives
Compare IDT74LVCH162244APF8 with alternatives