SN74LVCH32244AGKE
vs
IDT74LVCH16244APFG
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
TEXAS INSTRUMENTS INC
INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code
BGA
SOIC
Package Description
LFBGA, BGA96(UNSPEC)
TSSOP,
Pin Count
96
48
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Control Type
ENABLE LOW
Family
LVC/LCX/Z
LVC/LCX/Z
JESD-30 Code
R-PBGA-B96
R-PDSO-G48
Length
13.5 mm
9.7 mm
Logic IC Type
BUS DRIVER
BUS DRIVER
Max I(ol)
0.024 A
Number of Bits
4
4
Number of Functions
8
4
Number of Ports
2
2
Number of Terminals
96
48
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Characteristics
3-STATE
3-STATE
Output Polarity
TRUE
TRUE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LFBGA
TSSOP
Package Equivalence Code
BGA96(UNSPEC)
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, LOW PROFILE, FINE PITCH
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Propagation Delay (tpd)
4.7 ns
4.7 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.4 mm
1.2 mm
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
1.65 V
2.7 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
BALL
GULL WING
Terminal Pitch
0.8 mm
0.4 mm
Terminal Position
BOTTOM
DUAL
Width
5.5 mm
4.4 mm
Base Number Matches
2
1
JESD-609 Code
e0
Load Capacitance (CL)
50 pF
Terminal Finish
TIN LEAD
Compare SN74LVCH32244AGKE with alternatives
Compare IDT74LVCH16244APFG with alternatives