SN74LVC2G34DCK3 vs 74LVC2G17GV,125 feature comparison

SN74LVC2G34DCK3 Texas Instruments

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74LVC2G17GV,125 NXP Semiconductors

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Rohs Code No Yes
Part Life Cycle Code Active Transferred
Ihs Manufacturer TEXAS INSTRUMENTS INC NXP SEMICONDUCTORS
Package Description SC-70, 6 PIN PLASTIC, SC-74, SOT-457, 6 PIN
Reach Compliance Code compliant compliant
ECCN Code EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Samacsys Manufacturer Texas Instruments NXP
Family LVC/LCX/Z LVC/LCX/Z
JESD-30 Code R-PDSO-G6 R-PDSO-G6
JESD-609 Code e6 e3
Length 2 mm 2.9 mm
Logic IC Type BUFFER BUFFER
Max I(ol) 0.032 A 0.024 A
Moisture Sensitivity Level 1 1
Number of Functions 2 2
Number of Inputs 1 1
Number of Terminals 6 6
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP TSSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel) 260 260
Power Supply Current-Max (ICC) 0.01 mA
Propagation Delay (tpd) 8.6 ns 13.1 ns
Seated Height-Max 1.1 mm 1.1 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 1.65 V 1.65 V
Supply Voltage-Nom (Vsup) 3.3 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL AUTOMOTIVE
Terminal Finish Tin/Bismuth (Sn/Bi) Tin (Sn)
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 0.95 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30 30
Width 1.25 mm 1.5 mm
Base Number Matches 1 2
Part Package Code TSOP
Pin Count 6
Manufacturer Package Code SOT457
Load Capacitance (CL) 50 pF
Package Equivalence Code TSOP6,.11,37
Packing Method TR
Prop. Delay@Nom-Sup 7.1 ns
Qualification Status Not Qualified
Schmitt Trigger YES

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Compare 74LVC2G17GV,125 with alternatives