SN74LVC2G157YZAR
vs
SN74LVC258DR
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
TEXAS INSTRUMENTS INC
|
| Part Package Code |
DSBGA
|
|
| Package Description |
GREEN, MO-211EB, DSBGA-8
|
SOP,
|
| Pin Count |
8
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Family |
LVC/LCX/Z
|
LVC/LCX/Z
|
| JESD-30 Code |
R-PBGA-B8
|
R-PDSO-G16
|
| Length |
1.9 mm
|
9.9 mm
|
| Load Capacitance (CL) |
50 pF
|
|
| Logic IC Type |
MULTIPLEXER
|
MULTIPLEXER
|
| Max I(ol) |
0.024 A
|
|
| Number of Functions |
1
|
4
|
| Number of Inputs |
2
|
2
|
| Number of Outputs |
1
|
1
|
| Number of Terminals |
8
|
16
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Characteristics |
3-STATE
|
3-STATE
|
| Output Polarity |
COMPLEMENTARY
|
INVERTED
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
VFBGA
|
SOP
|
| Package Equivalence Code |
BGA8,2X4,20
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
SMALL OUTLINE
|
| Packing Method |
TR
|
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
| Prop. Delay@Nom-Sup |
6 ns
|
|
| Propagation Delay (tpd) |
14 ns
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
0.5 mm
|
1.75 mm
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
3.6 V
|
| Supply Voltage-Min (Vsup) |
1.65 V
|
2 V
|
| Supply Voltage-Nom (Vsup) |
1.8 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Form |
BALL
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
1.27 mm
|
| Terminal Position |
BOTTOM
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Width |
0.9 mm
|
3.9 mm
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare SN74LVC2G157YZAR with alternatives
Compare SN74LVC258DR with alternatives