SN74LVC2G157YZAR
vs
MC74LCX157SDR2
feature comparison
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
ON SEMICONDUCTOR
|
Part Package Code |
DSBGA
|
SOIC
|
Package Description |
GREEN, MO-211EB, DSBGA-8
|
SSOP,
|
Pin Count |
8
|
16
|
Reach Compliance Code |
unknown
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Family |
LVC/LCX/Z
|
LVC/LCX/Z
|
JESD-30 Code |
R-PBGA-B8
|
R-PDSO-G16
|
Length |
1.9 mm
|
6.2 mm
|
Load Capacitance (CL) |
50 pF
|
|
Logic IC Type |
MULTIPLEXER
|
MULTIPLEXER
|
Max I(ol) |
0.024 A
|
|
Number of Functions |
1
|
4
|
Number of Inputs |
2
|
2
|
Number of Outputs |
1
|
1
|
Number of Terminals |
8
|
16
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Output Characteristics |
3-STATE
|
|
Output Polarity |
COMPLEMENTARY
|
TRUE
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
VFBGA
|
SSOP
|
Package Equivalence Code |
BGA8,2X4,20
|
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
SMALL OUTLINE, SHRINK PITCH
|
Packing Method |
TR
|
|
Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
Prop. Delay@Nom-Sup |
6 ns
|
|
Propagation Delay (tpd) |
14 ns
|
6.3 ns
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
0.5 mm
|
2 mm
|
Supply Voltage-Max (Vsup) |
5.5 V
|
3.6 V
|
Supply Voltage-Min (Vsup) |
1.65 V
|
2 V
|
Supply Voltage-Nom (Vsup) |
1.8 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Form |
BALL
|
GULL WING
|
Terminal Pitch |
0.5 mm
|
0.65 mm
|
Terminal Position |
BOTTOM
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
Width |
0.9 mm
|
5.3 mm
|
Base Number Matches |
1
|
3
|
JESD-609 Code |
|
e0
|
Terminal Finish |
|
TIN LEAD
|
|
|
|
Compare SN74LVC2G157YZAR with alternatives
Compare MC74LCX157SDR2 with alternatives