SN74LVC2G157YZAR vs MC74LCX157SDR2 feature comparison

SN74LVC2G157YZAR Texas Instruments

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MC74LCX157SDR2 onsemi

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Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer TEXAS INSTRUMENTS INC ON SEMICONDUCTOR
Part Package Code DSBGA SOIC
Package Description GREEN, MO-211EB, DSBGA-8 SSOP,
Pin Count 8 16
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family LVC/LCX/Z LVC/LCX/Z
JESD-30 Code R-PBGA-B8 R-PDSO-G16
Length 1.9 mm 6.2 mm
Load Capacitance (CL) 50 pF
Logic IC Type MULTIPLEXER MULTIPLEXER
Max I(ol) 0.024 A
Number of Functions 1 4
Number of Inputs 2 2
Number of Outputs 1 1
Number of Terminals 8 16
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Characteristics 3-STATE
Output Polarity COMPLEMENTARY TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code VFBGA SSOP
Package Equivalence Code BGA8,2X4,20
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, VERY THIN PROFILE, FINE PITCH SMALL OUTLINE, SHRINK PITCH
Packing Method TR
Peak Reflow Temperature (Cel) NOT SPECIFIED
Prop. Delay@Nom-Sup 6 ns
Propagation Delay (tpd) 14 ns 6.3 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 0.5 mm 2 mm
Supply Voltage-Max (Vsup) 5.5 V 3.6 V
Supply Voltage-Min (Vsup) 1.65 V 2 V
Supply Voltage-Nom (Vsup) 1.8 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form BALL GULL WING
Terminal Pitch 0.5 mm 0.65 mm
Terminal Position BOTTOM DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 0.9 mm 5.3 mm
Base Number Matches 1 3
JESD-609 Code e0
Terminal Finish TIN LEAD

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