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SN74LVC2G08YEAR vs 74LVC2G08GM,115 feature comparison

SN74LVC2G08YEAR Rochester Electronics LLC

Buy Now Datasheet

74LVC2G08GM,115 NXP Semiconductors

Buy Now Datasheet
Pbfree Code Yes
Rohs Code No Yes
Part Life Cycle Code Active Obsolete
Ihs Manufacturer ROCHESTER ELECTRONICS LLC NXP SEMICONDUCTORS
Part Package Code DSBGA QFN
Package Description MO-211EB, DSBGA-8 1.60 X 1.60 MM, 0.50 MM HEIGHT, PLASTIC, MO-255, SOT902-1, QFN-8
Pin Count 8 8
Reach Compliance Code unknown unknown
Family LVC/LCX/Z LVC/LCX/Z
JESD-30 Code R-PBGA-B8 S-PBCC-B8
JESD-609 Code e0
Length 1.9 mm 1.6 mm
Logic IC Type AND GATE AND GATE
Moisture Sensitivity Level 1
Number of Functions 2 2
Number of Inputs 2 2
Number of Terminals 8 8
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code VFBGA VBCC
Package Shape RECTANGULAR SQUARE
Package Style GRID ARRAY, VERY THIN PROFILE, FINE PITCH CHIP CARRIER, VERY THIN PROFILE
Peak Reflow Temperature (Cel) 260
Propagation Delay (tpd) 9 ns 11.3 ns
Seated Height-Max 0.5 mm 0.5 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 1.65 V 1.65 V
Supply Voltage-Nom (Vsup) 1.8 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL AUTOMOTIVE
Terminal Finish TIN LEAD
Terminal Form BALL BUTT
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 0.9 mm 1.6 mm
Base Number Matches 2 2
Manufacturer Package Code SOT902-2
Package Equivalence Code LCC8,.06SQ,20
Packing Method TR
Qualification Status Not Qualified
Schmitt Trigger NO
Logic » Gates
Logic » Gates

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