74LVC2G08GM,115
vs
74LVC2G08GD
feature comparison
All Stats
Differences Only
Rohs Code
Yes
Yes
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
NXP SEMICONDUCTORS
NXP SEMICONDUCTORS
Part Package Code
QFN
SON
Package Description
1.60 X 1.60 MM, 0.50 MM HEIGHT, PLASTIC, MO-255, SOT902-1, QFN-8
3 X 2 MM, 0.50 MM HEIGHT, PLASTIC, SOT996-2, SON-8
Pin Count
8
8
Manufacturer Package Code
SOT902-2
Reach Compliance Code
unknown
compliant
Family
LVC/LCX/Z
LVC/LCX/Z
JESD-30 Code
S-PBCC-B8
R-PDSO-N8
Length
1.6 mm
3 mm
Logic IC Type
AND GATE
AND GATE
Number of Functions
2
2
Number of Inputs
2
2
Number of Terminals
8
8
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
VBCC
VSON
Package Equivalence Code
LCC8,.06SQ,20
SOLCC8,.11,20
Package Shape
SQUARE
RECTANGULAR
Package Style
CHIP CARRIER, VERY THIN PROFILE
SMALL OUTLINE, VERY THIN PROFILE
Packing Method
TR
TR
Propagation Delay (tpd)
11.3 ns
11.3 ns
Qualification Status
Not Qualified
Not Qualified
Schmitt Trigger
NO
NO
Seated Height-Max
0.5 mm
0.5 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
1.65 V
1.65 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
AUTOMOTIVE
Terminal Form
BUTT
NO LEAD
Terminal Pitch
0.5 mm
0.5 mm
Terminal Position
BOTTOM
DUAL
Width
1.6 mm
2 mm
Base Number Matches
2
2
Pbfree Code
Yes
HTS Code
8542.39.00.01
JESD-609 Code
e4
Moisture Sensitivity Level
1
Peak Reflow Temperature (Cel)
260
Terminal Finish
Nickel/Palladium/Gold (Ni/Pd/Au)
Time@Peak Reflow Temperature-Max (s)
30
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