SN74LVC1G66YZPR
vs
M74VHC1GT66DTT1G
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
TEXAS INSTRUMENTS INC
ONSEMI
Part Package Code
BGA
TSOP-5
Package Description
GREEN, WCSP-5
TSOP-5
Pin Count
5
5
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Samacsys Manufacturer
Texas Instruments
onsemi
Analog IC - Other Type
SPST
SPST
Bandwidth-Nom
300 MHz
JESD-30 Code
R-PBGA-B5
R-PDSO-G5
JESD-609 Code
e1
e3
Length
1.4 mm
3 mm
Moisture Sensitivity Level
1
1
Normal Position
NC
NO
Number of Channels
1
1
Number of Functions
1
1
Number of Terminals
5
5
Off-state Isolation-Nom
42 dB
80 dB
On-state Resistance Match-Nom
12 Ω
On-state Resistance-Max (Ron)
20 Ω
60 Ω
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-55 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
VFBGA
TSSOP
Package Equivalence Code
BGA5,3X2,20
TSOP5/6,.11,37
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel)
260
260
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
0.5 mm
1.1 mm
Signal Current-Max
0.1 A
Supply Current-Max (Isup)
0.01 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
1.65 V
2 V
Supply Voltage-Nom (Vsup)
2.3 V
3 V
Surface Mount
YES
YES
Switch-off Time-Max
6.9 ns
50 ns
Switch-on Time-Max
6.5 ns
50 ns
Switching
BREAK-BEFORE-MAKE
BREAK-BEFORE-MAKE
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
MILITARY
Terminal Finish
Tin/Silver/Copper (Sn/Ag/Cu)
MATTE TIN
Terminal Form
BALL
GULL WING
Terminal Pitch
0.5 mm
0.95 mm
Terminal Position
BOTTOM
DUAL
Time@Peak Reflow Temperature-Max (s)
30
30
Width
0.9 mm
1.5 mm
Base Number Matches
1
1
Manufacturer Package Code
483
Factory Lead Time
2 Days
Compare SN74LVC1G66YZPR with alternatives
Compare M74VHC1GT66DTT1G with alternatives