SN74LVC1G66YZPR
vs
MC74VHC1GT66DFT1
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Active
Transferred
Ihs Manufacturer
ROCHESTER ELECTRONICS LLC
MOTOROLA INC
Part Package Code
BGA
Package Description
GREEN, WCSP-5
SOT-353, SC-88A, 5 PIN
Pin Count
5
Reach Compliance Code
unknown
unknown
Analog IC - Other Type
SPST
SPST
JESD-30 Code
R-PBGA-B5
R-PDSO-G5
JESD-609 Code
e1
e0
Length
1.4 mm
2 mm
Moisture Sensitivity Level
1
Number of Channels
1
1
Number of Functions
1
1
Number of Terminals
5
5
Off-state Isolation-Nom
42 dB
40 dB
On-state Resistance-Max (Ron)
20 Ω
30 Ω
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-55 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
VFBGA
TSSOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel)
260
Seated Height-Max
0.5 mm
1.1 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
1.65 V
4.5 V
Supply Voltage-Nom (Vsup)
2.3 V
5 V
Surface Mount
YES
YES
Switch-off Time-Max
6.9 ns
10 ns
Switch-on Time-Max
6.5 ns
10 ns
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
MILITARY
Terminal Finish
TIN SILVER COPPER
Tin/Lead (Sn/Pb)
Terminal Form
BALL
GULL WING
Terminal Pitch
0.5 mm
0.65 mm
Terminal Position
BOTTOM
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
0.9 mm
1.25 mm
Base Number Matches
2
5
HTS Code
8542.39.00.01
Normal Position
NO
Package Equivalence Code
TSSOP6,.08
Qualification Status
Not Qualified
Switching
MAKE-BEFORE-BREAK
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