SN74LVC1G66YEAR
vs
MAX4597DCKRE4
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
TEXAS INSTRUMENTS INC
TEXAS INSTRUMENTS INC
Part Package Code
BGA
SOIC
Package Description
DSBGA-5
TSSOP, TSSOP5/6,.08
Pin Count
5
5
Reach Compliance Code
not_compliant
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Analog IC - Other Type
SPST
SPST
JESD-30 Code
R-XBGA-B5
R-PDSO-G5
Length
1.4 mm
2 mm
Normal Position
NO
NC
Number of Channels
1
1
Number of Functions
1
1
Number of Terminals
5
5
Off-state Isolation-Nom
42 dB
83 dB
On-state Resistance Match-Nom
12 Ω
On-state Resistance-Max (Ron)
20 Ω
20 Ω
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
UNSPECIFIED
PLASTIC/EPOXY
Package Code
VFBGA
TSSOP
Package Equivalence Code
BGA6,2X3,20
TSSOP5/6,.08
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel)
NOT SPECIFIED
260
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
0.5 mm
1.1 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
1.65 V
2 V
Supply Voltage-Nom (Vsup)
2.3 V
3 V
Surface Mount
YES
YES
Switch-off Time-Max
6.9 ns
50 ns
Switch-on Time-Max
6.5 ns
45 ns
Switching
BREAK-BEFORE-MAKE
MAKE-BEFORE-BREAK
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
BALL
GULL WING
Terminal Pitch
0.5 mm
0.65 mm
Terminal Position
BOTTOM
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
30
Width
0.9 mm
1.25 mm
Base Number Matches
2
1
Pbfree Code
JESD-609 Code
e4
Moisture Sensitivity Level
1
Terminal Finish
NICKEL PALLADIUM GOLD
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