SN74LVC158APWLE
vs
SN54LVC157AW
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
TEXAS INSTRUMENTS INC
|
| Part Package Code |
TSSOP
|
DFP
|
| Package Description |
TSSOP, TSSOP16,.25
|
DFP,
|
| Pin Count |
16
|
16
|
| Reach Compliance Code |
not_compliant
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Family |
LVC/LCX/Z
|
LVC/LCX/Z
|
| JESD-30 Code |
R-PDSO-G16
|
R-GDFP-F16
|
| Length |
5 mm
|
10.2 mm
|
| Load Capacitance (CL) |
50 pF
|
|
| Logic IC Type |
MULTIPLEXER
|
MULTIPLEXER
|
| Max I(ol) |
0.024 A
|
|
| Number of Functions |
4
|
4
|
| Number of Inputs |
2
|
2
|
| Number of Outputs |
1
|
1
|
| Number of Terminals |
16
|
16
|
| Operating Temperature-Max |
85 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-55 °C
|
| Output Polarity |
INVERTED
|
TRUE
|
| Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, GLASS-SEALED
|
| Package Code |
TSSOP
|
DFP
|
| Package Equivalence Code |
TSSOP16,.25
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
FLATPACK
|
| Packing Method |
TR
|
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.2 mm
|
2.03 mm
|
| Supply Voltage-Max (Vsup) |
3.6 V
|
3.6 V
|
| Supply Voltage-Min (Vsup) |
1.65 V
|
2 V
|
| Supply Voltage-Nom (Vsup) |
1.8 V
|
2.7 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
MILITARY
|
| Terminal Form |
GULL WING
|
FLAT
|
| Terminal Pitch |
0.65 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Width |
4.4 mm
|
6.73 mm
|
| Base Number Matches |
1
|
1
|
| Propagation Delay (tpd) |
|
6.2 ns
|
|
|
|
Compare SN74LVC158APWLE with alternatives
Compare SN54LVC157AW with alternatives