SN74LVC158APW
vs
MC74LCX158M
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
TEXAS INSTRUMENTS INC
ON SEMICONDUCTOR
Part Package Code
TSSOP
SOIC
Package Description
TSSOP,
SOP, SOP16,.3
Pin Count
16
16
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Family
LVC/LCX/Z
LVC/LCX/Z
JESD-30 Code
R-PDSO-G16
R-PDSO-G16
Length
5 mm
10.2 mm
Logic IC Type
MULTIPLEXER
MULTIPLEXER
Number of Functions
4
4
Number of Inputs
2
2
Number of Outputs
1
1
Number of Terminals
16
16
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Polarity
INVERTED
INVERTED
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSSOP
SOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
SMALL OUTLINE
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.2 mm
2.05 mm
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
1.65 V
2 V
Supply Voltage-Nom (Vsup)
1.8 V
2.7 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.65 mm
1.27 mm
Terminal Position
DUAL
DUAL
Width
4.4 mm
5.275 mm
Base Number Matches
3
4
Rohs Code
Yes
JESD-609 Code
e4
Load Capacitance (CL)
50 pF
Max I(ol)
0.024 A
Package Equivalence Code
SOP16,.3
Packing Method
RAIL
Peak Reflow Temperature (Cel)
260
Prop. Delay@Nom-Sup
6.5 ns
Propagation Delay (tpd)
8.5 ns
Terminal Finish
NICKEL PALLADIUM GOLD
Compare SN74LVC158APW with alternatives
Compare MC74LCX158M with alternatives