SN74LS30NS
vs
HD74LS21FPEL
feature comparison
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
MOTOROLA INC
|
RENESAS ELECTRONICS CORP
|
| Part Package Code |
DIP
|
SOIC
|
| Package Description |
DIP, DIP14,.3
|
SOP, SOP14,.3
|
| Pin Count |
14
|
14
|
| Reach Compliance Code |
unknown
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Family |
LS
|
LS
|
| JESD-30 Code |
R-PDIP-T14
|
R-PDSO-G14
|
| JESD-609 Code |
e0
|
|
| Length |
18.86 mm
|
10.06 mm
|
| Logic IC Type |
NAND GATE
|
AND GATE
|
| Number of Functions |
1
|
2
|
| Number of Inputs |
8
|
4
|
| Number of Terminals |
14
|
14
|
| Operating Temperature-Max |
70 °C
|
75 °C
|
| Operating Temperature-Min |
|
-20 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
SOP
|
| Package Equivalence Code |
DIP14,.3
|
SOP14,.3
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
SMALL OUTLINE
|
| Propagation Delay (tpd) |
20 ns
|
20 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Schmitt Trigger |
NO
|
NO
|
| Seated Height-Max |
5.08 mm
|
2.2 mm
|
| Supply Voltage-Max (Vsup) |
5.25 V
|
5.25 V
|
| Supply Voltage-Min (Vsup) |
4.75 V
|
4.75 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
NO
|
YES
|
| Technology |
TTL
|
TTL
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL EXTENDED
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
THROUGH-HOLE
|
GULL WING
|
| Terminal Pitch |
2.54 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
7.62 mm
|
5.5 mm
|
| Base Number Matches |
1
|
3
|
| Pbfree Code |
|
Yes
|
| Load Capacitance (CL) |
|
15 pF
|
| Max I(ol) |
|
0.008 A
|
| Moisture Sensitivity Level |
|
1
|
| Packing Method |
|
TR
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Power Supply Current-Max (ICC) |
|
4.4 mA
|
| Prop. Delay@Nom-Sup |
|
20 ns
|
| Time@Peak Reflow Temperature-Max (s) |
|
20
|
|
|
|
Compare SN74LS30NS with alternatives
Compare HD74LS21FPEL with alternatives