SN74LS253DG4 vs SN74LS253NDS feature comparison

SN74LS253DG4 Texas Instruments

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SN74LS253NDS Freescale Semiconductor

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Pbfree Code No
Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer TEXAS INSTRUMENTS INC MOTOROLA SEMICONDUCTOR PRODUCTS
Part Package Code SOIC
Package Description SOP, SOP16,.25 DIP, DIP16,.3
Pin Count 16
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01
Family LS LS
JESD-30 Code R-PDSO-G16 R-PDIP-T16
JESD-609 Code e4 e0
Length 9.9 mm 20.07 mm
Load Capacitance (CL) 15 pF
Logic IC Type MULTIPLEXER MULTIPLEXER
Max I(ol) 0.008 A
Moisture Sensitivity Level 1
Number of Functions 2 2
Number of Inputs 4 4
Number of Outputs 1 1
Number of Terminals 16 16
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Output Characteristics 3-STATE 3-STATE
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP DIP
Package Equivalence Code SOP16,.25 DIP16,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE IN-LINE
Packing Method TUBE
Peak Reflow Temperature (Cel) 260 NOT SPECIFIED
Power Supply Current-Max (ICC) 14 mA
Prop. Delay@Nom-Sup 25 ns
Propagation Delay (tpd) 25 ns 32 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.75 mm 5.08 mm
Supply Voltage-Max (Vsup) 5.25 V 5.25 V
Supply Voltage-Min (Vsup) 4.75 V 4.75 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES NO
Technology TTL TTL
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish NICKEL PALLADIUM GOLD Tin/Lead (Sn/Pb)
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 1.27 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30 NOT SPECIFIED
Width 3.9 mm 7.62 mm
Base Number Matches 2 3
Power Supplies 5 V

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