SN74LS253NDS
vs
DM74LS253M
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
MOTOROLA SEMICONDUCTOR PRODUCTS
NATIONAL SEMICONDUCTOR CORP
Package Description
DIP, DIP16,.3
0.150 INCH, PLASTIC, SOP-16
Reach Compliance Code
unknown
compliant
Family
LS
LS
JESD-30 Code
R-PDIP-T16
R-PDSO-G16
JESD-609 Code
e0
e0
Length
20.07 mm
9.9 mm
Logic IC Type
MULTIPLEXER
MULTIPLEXER
Number of Functions
2
2
Number of Inputs
4
4
Number of Outputs
1
1
Number of Terminals
16
16
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Output Characteristics
3-STATE
3-STATE
Output Polarity
TRUE
TRUE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
SOP
Package Equivalence Code
DIP16,.3
SOP16,.25
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
SMALL OUTLINE
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Power Supplies
5 V
Propagation Delay (tpd)
32 ns
32 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.08 mm
1.75 mm
Supply Voltage-Max (Vsup)
5.25 V
5.25 V
Supply Voltage-Min (Vsup)
4.75 V
4.75 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
YES
Technology
TTL
TTL
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
Tin/Lead (Sn/Pb)
Tin/Lead (Sn/Pb)
Terminal Form
THROUGH-HOLE
GULL WING
Terminal Pitch
2.54 mm
1.27 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
7.62 mm
3.9 mm
Base Number Matches
3
4
Load Capacitance (CL)
45 pF
Max I(ol)
0.024 A
Power Supply Current-Max (ICC)
12 mA
Prop. Delay@Nom-Sup
25 ns
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