SN74LS182NS
vs
HD74LS148FPEL
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MOTOROLA INC
RENESAS ELECTRONICS CORP
Part Package Code
DIP
SOIC
Package Description
DIP, DIP16,.3
SOP, SOP16,.3
Pin Count
16
16
Reach Compliance Code
unknown
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Additional Feature
WITH HIGHER ORDER LOOKAHEAD
Family
LS
LS
JESD-30 Code
R-PDIP-T16
R-PDSO-G16
JESD-609 Code
e0
Length
20.07 mm
10.06 mm
Logic IC Type
LOOK-AHEAD CARRY GENERATOR
ENCODER
Number of Bits
4
8
Number of Functions
1
1
Number of Terminals
16
16
Operating Temperature-Max
70 °C
75 °C
Operating Temperature-Min
-20 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
SOP
Package Equivalence Code
DIP16,.3
SOP16,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
SMALL OUTLINE
Propagation Delay (tpd)
30 ns
36 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.08 mm
2.2 mm
Supply Voltage-Max (Vsup)
5.25 V
5.25 V
Supply Voltage-Min (Vsup)
4.75 V
4.75 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
YES
Technology
TTL
TTL
Temperature Grade
COMMERCIAL
COMMERCIAL EXTENDED
Terminal Finish
TIN LEAD
Terminal Form
THROUGH-HOLE
GULL WING
Terminal Pitch
2.54 mm
1.27 mm
Terminal Position
DUAL
DUAL
Width
7.62 mm
5.5 mm
Base Number Matches
3
1
Moisture Sensitivity Level
1
Peak Reflow Temperature (Cel)
260
Time@Peak Reflow Temperature-Max (s)
20
Compare SN74LS182NS with alternatives
Compare HD74LS148FPEL with alternatives