SN74LS138NDS
vs
HD74HC137FP-E
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MOTOROLA INC
RENESAS ELECTRONICS CORP
Part Package Code
DIP
SOIC
Package Description
DIP, DIP16,.3
SOP,
Pin Count
16
16
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Additional Feature
3 ENABLE INPUTS
Family
LS
HC/UH
Input Conditioning
STANDARD
LATCHED
JESD-30 Code
R-PDIP-T16
R-PDSO-G16
JESD-609 Code
e0
Length
20.07 mm
10.06 mm
Logic IC Type
3-LINE TO 8-LINE DECODER
3-LINE TO 8-LINE DECODER
Number of Functions
1
1
Number of Terminals
16
16
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
-40 °C
Output Polarity
INVERTED
INVERTED
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
SOP
Package Equivalence Code
DIP16,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
SMALL OUTLINE
Propagation Delay (tpd)
41 ns
300 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.08 mm
2.2 mm
Supply Voltage-Max (Vsup)
5.25 V
6 V
Supply Voltage-Min (Vsup)
4.75 V
2 V
Supply Voltage-Nom (Vsup)
5 V
4.5 V
Surface Mount
NO
YES
Technology
TTL
CMOS
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Finish
Tin/Lead (Sn/Pb)
Terminal Form
THROUGH-HOLE
GULL WING
Terminal Pitch
2.54 mm
1.27 mm
Terminal Position
DUAL
DUAL
Width
7.62 mm
5.5 mm
Base Number Matches
1
3
Pbfree Code
Rohs Code
Moisture Sensitivity Level
1
Compare SN74LS138NDS with alternatives
Compare HD74HC137FP-E with alternatives