SN74GTLPH1655DGG
vs
74GTL16622DL
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
NXP SEMICONDUCTORS
|
| Part Package Code |
TSSOP
|
|
| Package Description |
PLASTIC, TSSOP-64
|
SSOP,
|
| Pin Count |
64
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Family |
GTLP
|
GTL/TVC
|
| JESD-30 Code |
R-PDSO-G64
|
R-PDSO-G56
|
| JESD-609 Code |
e4
|
|
| Length |
17 mm
|
18.425 mm
|
| Logic IC Type |
REGISTERED BUS TRANSCEIVER
|
REGISTERED BUS TRANSCEIVER
|
| Moisture Sensitivity Level |
1
|
|
| Number of Bits |
8
|
18
|
| Number of Functions |
2
|
1
|
| Number of Ports |
2
|
2
|
| Number of Terminals |
64
|
56
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Characteristics |
3-STATE
|
OPEN-COLLECTOR/3-STATE
|
| Output Polarity |
TRUE
|
TRUE
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TSSOP
|
SSOP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE, SHRINK PITCH
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Propagation Delay (tpd) |
8 ns
|
3.8 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.2 mm
|
2.8 mm
|
| Supply Voltage-Max (Vsup) |
3.45 V
|
3.45 V
|
| Supply Voltage-Min (Vsup) |
3.15 V
|
3.15 V
|
| Supply Voltage-Nom (Vsup) |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
BICMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
NICKEL PALLADIUM GOLD
|
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
0.635 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
6.1 mm
|
7.5 mm
|
| Base Number Matches |
2
|
2
|
|
|
|
Compare SN74GTLPH1655DGG with alternatives
Compare 74GTL16622DL with alternatives