SN74CBTK32245GKER
vs
QS34XVH245Q3G
feature comparison
| Pbfree Code |
No
|
No
|
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
ROCHESTER ELECTRONICS LLC
|
| Part Package Code |
BGA
|
SOIC
|
| Package Description |
PLASTIC, LFBGA-96
|
GREEN, QVSOP-80
|
| Pin Count |
96
|
80
|
| Reach Compliance Code |
not_compliant
|
unknown
|
| HTS Code |
8542.39.00.01
|
|
| Family |
CBT/FST/QS/5C/B
|
CBT/FST/QS/5C/B
|
| JESD-30 Code |
R-PBGA-B96
|
R-PDSO-G80
|
| JESD-609 Code |
e0
|
e3
|
| Length |
13.5 mm
|
20.5 mm
|
| Logic IC Type |
BUS DRIVER
|
BUS DRIVER
|
| Moisture Sensitivity Level |
2
|
NOT SPECIFIED
|
| Number of Bits |
8
|
8
|
| Number of Functions |
4
|
4
|
| Number of Ports |
2
|
2
|
| Number of Terminals |
96
|
80
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Characteristics |
3-STATE
|
3-STATE
|
| Output Polarity |
TRUE
|
TRUE
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
LFBGA
|
SSOP
|
| Package Equivalence Code |
BGA96,6X16,32
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
GRID ARRAY, LOW PROFILE, FINE PITCH
|
SMALL OUTLINE, SHRINK PITCH
|
| Peak Reflow Temperature (Cel) |
235
|
260
|
| Propagation Delay (tpd) |
0.35 ns
|
0.2 ns
|
| Qualification Status |
Not Qualified
|
COMMERCIAL
|
| Seated Height-Max |
1.4 mm
|
2 mm
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
3.6 V
|
| Supply Voltage-Min (Vsup) |
4 V
|
2.3 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
2.5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
BICMOS
|
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
TIN LEAD
|
MATTE TIN
|
| Terminal Form |
BALL
|
GULL WING
|
| Terminal Pitch |
0.8 mm
|
0.5 mm
|
| Terminal Position |
BOTTOM
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
20
|
30
|
| Width |
5.5 mm
|
3.9 mm
|
| Base Number Matches |
1
|
3
|
|
|
|
Compare SN74CBTK32245GKER with alternatives
Compare QS34XVH245Q3G with alternatives