SN74ABT574AGQNR
vs
SN74ABT574AZQNR
feature comparison
Rohs Code |
No
|
|
Part Life Cycle Code |
Obsolete
|
Active
|
Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
ROCHESTER ELECTRONICS LLC
|
Part Package Code |
BGA
|
|
Package Description |
VFBGA, BGA20,4X5,25
|
VFBGA,
|
Pin Count |
20
|
|
Reach Compliance Code |
not_compliant
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Additional Feature |
BROADSIDE VERSION OF 374
|
BROADSIDE VERSION OF 374
|
Family |
ABT
|
ABT
|
JESD-30 Code |
R-PBGA-B20
|
R-PBGA-B20
|
Length |
4 mm
|
4 mm
|
Logic IC Type |
BUS DRIVER
|
BUS DRIVER
|
Max Frequency@Nom-Sup |
150000000 Hz
|
|
Max I(ol) |
0.064 A
|
|
Number of Bits |
8
|
8
|
Number of Functions |
1
|
1
|
Number of Ports |
2
|
2
|
Number of Terminals |
20
|
20
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Output Characteristics |
3-STATE
|
3-STATE
|
Output Polarity |
TRUE
|
TRUE
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
VFBGA
|
VFBGA
|
Package Equivalence Code |
BGA20,4X5,25
|
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
Packing Method |
TR
|
|
Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
Power Supply Current-Max (ICC) |
30 mA
|
|
Prop. Delay@Nom-Sup |
7.1 ns
|
|
Propagation Delay (tpd) |
7.1 ns
|
7.1 ns
|
Qualification Status |
Not Qualified
|
|
Seated Height-Max |
1 mm
|
1 mm
|
Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
BICMOS
|
BICMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
0.65 mm
|
0.65 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
Trigger Type |
POSITIVE EDGE
|
|
Width |
3 mm
|
3 mm
|
Base Number Matches |
1
|
1
|
|
|
|