SN65LVDS93AZQLR
vs
BU8254KVT
feature comparison
Pbfree Code |
Yes
|
Yes
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Active
|
Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
ROHM CO LTD
|
Part Package Code |
BGA
|
QFP
|
Package Description |
BGA-56
|
QFP, TQFP64,.47SQ
|
Pin Count |
56
|
64
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Differential Output |
YES
|
|
Driver Number of Bits |
4
|
|
High Level Input Current-Max |
0.000025 A
|
|
Input Characteristics |
STANDARD
|
|
Interface IC Type |
LINE DRIVER
|
LINE DRIVER
|
Interface Standard |
GENERAL PURPOSE
|
|
JESD-30 Code |
R-PBGA-B56
|
S-PQFP-G64
|
JESD-609 Code |
e1
|
e2
|
Length |
7 mm
|
|
Moisture Sensitivity Level |
2
|
|
Number of Functions |
4
|
|
Number of Terminals |
56
|
64
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-20 °C
|
Output Characteristics |
DIFFERENTIAL
|
|
Output Polarity |
COMPLEMENTARY
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
VFBGA
|
QFP
|
Package Equivalence Code |
BGA56,6X10,25
|
TQFP64,.47SQ
|
Package Shape |
RECTANGULAR
|
SQUARE
|
Package Style |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
FLATPACK
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1 mm
|
|
Supply Current-Max |
116 mA
|
|
Supply Voltage-Max |
3.6 V
|
|
Supply Voltage-Min |
3 V
|
|
Supply Voltage-Nom |
3.3 V
|
3.3 V
|
Supply Voltage1-Max |
3.6 V
|
|
Supply Voltage1-Min |
3 V
|
|
Supply Voltage1-Nom |
3.3 V
|
|
Surface Mount |
YES
|
YES
|
Temperature Grade |
INDUSTRIAL
|
OTHER
|
Terminal Finish |
Tin/Silver/Copper (Sn/Ag/Cu)
|
Tin/Copper (Sn/Cu)
|
Terminal Form |
BALL
|
GULL WING
|
Terminal Pitch |
0.65 mm
|
0.5 mm
|
Terminal Position |
BOTTOM
|
QUAD
|
Time@Peak Reflow Temperature-Max (s) |
30
|
10
|
Width |
4.5 mm
|
|
Base Number Matches |
2
|
1
|
|
|
|
Compare SN65LVDS93AZQLR with alternatives
Compare BU8254KVT with alternatives