SN65LBC173DG4 vs AM26LS32BIN feature comparison

SN65LBC173DG4 Texas Instruments

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AM26LS32BIN Philips Semiconductors

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Rohs Code Yes No
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer TEXAS INSTRUMENTS INC PHILIPS SEMICONDUCTORS
Part Package Code SOIC
Package Description SOP, SOP16,.25 DIP, DIP16,.3
Pin Count 16
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Input Characteristics DIFFERENTIAL SCHMITT TRIGGER
Interface IC Type LINE RECEIVER LINE RECEIVER
Interface Standard EIA-422-B; TIA-422-B; EIA-423-B; TIA-423-B; EIA-485; V.10; V.11
JESD-30 Code R-PDSO-G16 R-PDIP-T16
JESD-609 Code e4 e0
Length 9.9 mm
Moisture Sensitivity Level 1
Number of Functions 4
Number of Terminals 16 16
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Characteristics 3-STATE
Output Low Current-Max 0.016 A 0.024 A
Output Polarity TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP DIP
Package Equivalence Code SOP16,.25 DIP16,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE IN-LINE
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified Not Qualified
Receive Delay-Max 30 ns 26 ns
Receiver Number of Bits 4
Seated Height-Max 1.75 mm
Supply Current-Max 20 mA 70 mA
Supply Voltage-Max 5.25 V
Supply Voltage-Min 4.75 V
Supply Voltage-Nom 5 V 5 V
Supply Voltage1-Max 5.25 V
Supply Voltage1-Min 4.75 V
Supply Voltage1-Nom 5 V
Surface Mount YES NO
Technology BICMOS TTL
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au) Tin/Lead (Sn/Pb)
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 1.27 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30
Width 3.9 mm
Base Number Matches 1 3

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