SN65LBC173ADG4 vs AM26LS32BIN feature comparison

SN65LBC173ADG4 Texas Instruments

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AM26LS32BIN Philips Semiconductors

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Pbfree Code Yes
Rohs Code Yes No
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer TEXAS INSTRUMENTS INC PHILIPS SEMICONDUCTORS
Part Package Code SOIC
Package Description SOIC-16 DIP, DIP16,.3
Pin Count 16
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Samacsys Manufacturer Texas Instruments
Driver Number of Bits 4
High Level Input Current-Max 0.0001 A
Input Characteristics DIFFERENTIAL SCHMITT TRIGGER
Interface IC Type LINE RECEIVER LINE RECEIVER
Interface Standard EIA-422; TIA-422; EIA-485; TIA-485; ISO 8482
JESD-30 Code R-PDSO-G16 R-PDIP-T16
JESD-609 Code e4 e0
Length 9.9 mm
Moisture Sensitivity Level 1
Number of Functions 4
Number of Terminals 16 16
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Characteristics 3-STATE
Output Low Current-Max 0.008 A 0.024 A
Output Polarity TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP DIP
Package Equivalence Code SOP16,.25 DIP16,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE IN-LINE
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified Not Qualified
Receive Delay-Max 16 ns 26 ns
Receiver Number of Bits 4
Seated Height-Max 1.75 mm
Supply Current-Max 20 mA 70 mA
Supply Voltage-Max 5.25 V
Supply Voltage-Min 4.75 V
Supply Voltage-Nom 5 V 5 V
Supply Voltage1-Max 5.25 V
Supply Voltage1-Min 4.75 V
Supply Voltage1-Nom 5 V
Surface Mount YES NO
Technology BICMOS TTL
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au) Tin/Lead (Sn/Pb)
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 1.27 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 3.9 mm
Base Number Matches 1 3

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