SMOMAPL138BGWTA3R
vs
AM1808BZCED4
feature comparison
All Stats
Differences Only
Pbfree Code
Yes
Rohs Code
No
Yes
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
TEXAS INSTRUMENTS INC
TEXAS INSTRUMENTS INC
Part Package Code
BGA
BGA
Package Description
NFBGA-361
NFBGA-361
Pin Count
361
361
Reach Compliance Code
not_compliant
compliant
ECCN Code
3A991.A.2
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Samacsys Manufacturer
Texas Instruments
Address Bus Width
23
23
Bit Size
32
32
Boundary Scan
YES
YES
Clock Frequency-Max
30 MHz
50 MHz
External Data Bus Width
16
16
Format
FLOATING POINT
FIXED POINT
Integrated Cache
YES
YES
JESD-30 Code
S-PBGA-B361
S-PBGA-B361
JESD-609 Code
e0
e1
Length
16 mm
13 mm
Low Power Mode
YES
YES
Moisture Sensitivity Level
3
3
Number of DMA Channels
64
Number of Terminals
361
361
On Chip Data RAM Width
8
Operating Temperature-Max
105 °C
90 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LFBGA
LFBGA
Package Equivalence Code
BGA361,19X19,32
BGA361,19X19,25
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, LOW PROFILE, FINE PITCH
GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel)
220
260
Qualification Status
Not Qualified
Not Qualified
RAM (words)
131072
Seated Height-Max
1.4 mm
1.3 mm
Speed
456 MHz
456 MHz
Supply Current-Max
0.31 mA
Supply Voltage-Max
1.32 V
1.35 V
Supply Voltage-Min
1.14 V
1.25 V
Supply Voltage-Nom
1.2 V
1.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
TIN LEAD
TIN SILVER COPPER
Terminal Form
BALL
BALL
Terminal Pitch
0.8 mm
0.65 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
20
30
Width
16 mm
13 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
MICROPROCESSOR, RISC
Base Number Matches
1
1
Additional Feature
ALSO OPERATES AT 1V AND 1.1 V NOMINAL
Compare SMOMAPL138BGWTA3R with alternatives
Compare AM1808BZCED4 with alternatives