SMOMAPL138BGWTA3R vs AM1808BZCED4 feature comparison

SMOMAPL138BGWTA3R Texas Instruments

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AM1808BZCED4 Texas Instruments

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Pbfree Code Yes
Rohs Code No Yes
Part Life Cycle Code Active Obsolete
Ihs Manufacturer TEXAS INSTRUMENTS INC TEXAS INSTRUMENTS INC
Part Package Code BGA BGA
Package Description NFBGA-361 NFBGA-361
Pin Count 361 361
Reach Compliance Code not_compliant compliant
ECCN Code 3A991.A.2 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Samacsys Manufacturer Texas Instruments
Address Bus Width 23 23
Bit Size 32 32
Boundary Scan YES YES
Clock Frequency-Max 30 MHz 50 MHz
External Data Bus Width 16 16
Format FLOATING POINT FIXED POINT
Integrated Cache YES YES
JESD-30 Code S-PBGA-B361 S-PBGA-B361
JESD-609 Code e0 e1
Length 16 mm 13 mm
Low Power Mode YES YES
Moisture Sensitivity Level 3 3
Number of DMA Channels 64
Number of Terminals 361 361
On Chip Data RAM Width 8
Operating Temperature-Max 105 °C 90 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LFBGA LFBGA
Package Equivalence Code BGA361,19X19,32 BGA361,19X19,25
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) 220 260
Qualification Status Not Qualified Not Qualified
RAM (words) 131072
Seated Height-Max 1.4 mm 1.3 mm
Speed 456 MHz 456 MHz
Supply Current-Max 0.31 mA
Supply Voltage-Max 1.32 V 1.35 V
Supply Voltage-Min 1.14 V 1.25 V
Supply Voltage-Nom 1.2 V 1.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN LEAD TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.65 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 20 30
Width 16 mm 13 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches 1 1
Additional Feature ALSO OPERATES AT 1V AND 1.1 V NOMINAL

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Compare AM1808BZCED4 with alternatives