SMJ320C40KGDM50C
vs
TMS320C40GFL50
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
TEXAS INSTRUMENTS INC
TEXAS INSTRUMENTS INC
Part Package Code
DIE
PGA
Package Description
DIE, DIE OR CHIP
Pin Count
325
325
Reach Compliance Code
unknown
not_compliant
ECCN Code
3A991.A.2
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Address Bus Width
31
31
Barrel Shifter
NO
YES
Bit Size
32
32
Boundary Scan
YES
YES
Clock Frequency-Max
50 MHz
50 MHz
External Data Bus Width
32
32
Format
FLOATING POINT
FLOATING POINT
Internal Bus Architecture
MULTIPLE
MULTIPLE
JESD-30 Code
R-XUUC-N325
S-CPGA-P325
Low Power Mode
NO
YES
Number of Terminals
325
325
Operating Temperature-Max
125 °C
70 °C
Operating Temperature-Min
-55 °C
Package Body Material
UNSPECIFIED
CERAMIC, METAL-SEALED COFIRED
Package Code
DIE
IPGA
Package Equivalence Code
DIE OR CHIP
SPGA325,35X35MOD
Package Shape
RECTANGULAR
SQUARE
Package Style
UNCASED CHIP
GRID ARRAY, INTERSTITIAL PITCH
Qualification Status
Not Qualified
Not Qualified
RAM (words)
8192
4096
Screening Level
MIL-PRF-38535
Supply Voltage-Max
5.5 V
5.25 V
Supply Voltage-Min
4.5 V
4.75 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
YES
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
COMMERCIAL
Terminal Form
NO LEAD
PIN/PEG
Terminal Position
UPPER
PERPENDICULAR
uPs/uCs/Peripheral ICs Type
DIGITAL SIGNAL PROCESSOR, OTHER
DIGITAL SIGNAL PROCESSOR, OTHER
Base Number Matches
1
1
Pbfree Code
Rohs Code
Integrated Cache
NO
JESD-609 Code
e4
Length
47.25 mm
Number of DMA Channels
6
Number of External Interrupts
5
Number of Serial I/Os
Number of Timers
2
On Chip Data RAM Width
8
Seated Height-Max
5.08 mm
Supply Current-Max
850 mA
Terminal Finish
Gold (Au)
Terminal Pitch
2.54 mm
Width
47.25 mm
Compare SMJ320C40KGDM50C with alternatives
Compare TMS320C40GFL50 with alternatives