SMCG5.0CAE3
vs
1.5SMC8.2_R1_10001
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
MICROSEMI CORP
|
PAN JIT INTERNATIONAL INC
|
| Part Package Code |
DO-215AB
|
|
| Package Description |
R-PDSO-G2
|
|
| Pin Count |
2
|
|
| Reach Compliance Code |
compliant
|
not_compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8541.10.00.50
|
8541.10.00.50
|
| Breakdown Voltage-Max |
7 V
|
9.02 V
|
| Breakdown Voltage-Min |
6.4 V
|
7.38 V
|
| Breakdown Voltage-Nom |
6.7 V
|
8.2 V
|
| Clamping Voltage-Max |
9.2 V
|
12.5 V
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Type |
TRANS VOLTAGE SUPPRESSOR DIODE
|
TRANS VOLTAGE SUPPRESSOR DIODE
|
| JEDEC-95 Code |
DO-215AB
|
DO-214AB
|
| JESD-30 Code |
R-PDSO-G2
|
R-PDSO-C2
|
| JESD-609 Code |
e3
|
|
| Non-rep Peak Rev Power Dis-Max |
1500 W
|
1500 W
|
| Number of Elements |
1
|
1
|
| Number of Terminals |
2
|
2
|
| Operating Temperature-Max |
150 °C
|
150 °C
|
| Operating Temperature-Min |
-65 °C
|
-55 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
| Polarity |
BIDIRECTIONAL
|
UNIDIRECTIONAL
|
| Power Dissipation-Max |
1.56 W
|
|
| Qualification Status |
Not Qualified
|
|
| Rep Pk Reverse Voltage-Max |
5 V
|
6.63 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
AVALANCHE
|
AVALANCHE
|
| Terminal Finish |
MATTE TIN
|
|
| Terminal Form |
GULL WING
|
C BEND
|
| Terminal Position |
DUAL
|
DUAL
|
| Base Number Matches |
23
|
2
|
| Additional Feature |
|
EXCELLENT CLAMPING CAPABILITY, LOW ZENER IMPEDANCE
|
| Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
| Reference Standard |
|
MIL-STD-750
|
| Reverse Current-Max |
|
200 µA
|
| Reverse Test Voltage |
|
6.63 V
|
| Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
|
|
|
Compare SMCG5.0CAE3 with alternatives
Compare 1.5SMC8.2_R1_10001 with alternatives