SM2M64SDT-10
vs
HB52D88DC-A6FL
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
ENHANCED MEMORY SYSTEMS INC
HITACHI LTD
Part Package Code
MODULE
MODULE
Package Description
DIMM,
DIMM,
Pin Count
144
144
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.02
8542.32.00.02
Access Mode
DUAL BANK PAGE BURST
DUAL BANK PAGE BURST
Additional Feature
AUTO/SELF REFRESH
AUTO/SELF REFRESH; WD-MAX; SEATED HGT-NOM
JESD-30 Code
R-XDMA-N144
R-XDMA-N144
Memory Density
16777216 bit
67108864 bit
Memory IC Type
CACHE DRAM MODULE
SYNCHRONOUS DRAM MODULE
Memory Width
8
8
Number of Functions
1
1
Number of Ports
1
1
Number of Terminals
144
144
Number of Words
2097152 words
8388608 words
Number of Words Code
2000000
8000000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Organization
2MX8
8MX8
Package Body Material
UNSPECIFIED
UNSPECIFIED
Package Code
DIMM
DIMM
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
MICROELECTRONIC ASSEMBLY
MICROELECTRONIC ASSEMBLY
Qualification Status
Not Qualified
Not Qualified
Self Refresh
YES
YES
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
3 V
3 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Terminal Form
NO LEAD
NO LEAD
Terminal Position
DUAL
DUAL
Base Number Matches
1
1
Access Time-Max
6 ns
Length
67.6 mm
Operating Temperature-Max
65 °C
Operating Temperature-Min
Seated Height-Max
31.75 mm
Temperature Grade
COMMERCIAL
Terminal Pitch
0.8 mm
Width
3.8 mm
Compare SM2M64SDT-10 with alternatives
Compare HB52D88DC-A6FL with alternatives