HB52D88DC-A6FL vs WED3DG728V75D1 feature comparison

HB52D88DC-A6FL Hitachi Ltd

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WED3DG728V75D1 Microsemi Corporation

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer HITACHI LTD MICROSEMI CORP
Part Package Code MODULE SODIMM
Package Description DIMM, DIMM,
Pin Count 144 144
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.02 8542.32.00.32
Access Mode DUAL BANK PAGE BURST FOUR BANK PAGE BURST
Access Time-Max 6 ns
Additional Feature AUTO/SELF REFRESH; WD-MAX; SEATED HGT-NOM AUTO/SELF REFRESH
JESD-30 Code R-XDMA-N144 R-XZMA-N144
Length 67.6 mm
Memory Density 67108864 bit 603979776 bit
Memory IC Type SYNCHRONOUS DRAM MODULE SYNCHRONOUS DRAM MODULE
Memory Width 8 72
Number of Functions 1 1
Number of Ports 1 1
Number of Terminals 144 144
Number of Words 8388608 words 8388608 words
Number of Words Code 8000000 8000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 65 °C 70 °C
Operating Temperature-Min
Organization 8MX8 8MX72
Package Body Material UNSPECIFIED UNSPECIFIED
Package Code DIMM DIMM
Package Shape RECTANGULAR RECTANGULAR
Package Style MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 31.75 mm
Self Refresh YES YES
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 3 V 3 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Form NO LEAD NO LEAD
Terminal Pitch 0.8 mm
Terminal Position DUAL ZIG-ZAG
Width 3.8 mm
Base Number Matches 1 2
Pbfree Code No
Rohs Code No
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

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Compare WED3DG728V75D1 with alternatives