SM0402K2003JGBU
vs
SM0402K2003JSFP
feature comparison
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Contact Manufacturer
|
Contact Manufacturer
|
| Ihs Manufacturer |
OHMCRAFT
|
OHMCRAFT
|
| Reach Compliance Code |
compliant
|
not_compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| Construction |
Chip
|
Chip
|
| JESD-609 Code |
e4
|
e0
|
| Number of Terminals |
2
|
2
|
| Operating Temperature-Max |
150 °C
|
150 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Package Height |
0.51 mm
|
0.51 mm
|
| Package Length |
1.02 mm
|
1.02 mm
|
| Package Style |
SMT
|
SMT
|
| Package Width |
0.51 mm
|
0.51 mm
|
| Packing Method |
Bulk
|
|
| Rated Power Dissipation (P) |
0.04 W
|
0.04 W
|
| Resistance |
200000 Ω
|
200000 Ω
|
| Resistor Type |
FIXED RESISTOR
|
FIXED RESISTOR
|
| Series |
SM
|
SM
|
| Size Code |
0402
|
0402
|
| Technology |
METAL GLAZE/THICK FILM
|
METAL GLAZE/THICK FILM
|
| Temperature Coefficient |
100 ppm/°C
|
100 ppm/°C
|
| Terminal Finish |
Gold (Au)
|
Tin/Lead (Sn63Pb37)
|
| Tolerance |
5%
|
5%
|
| Working Voltage |
50 V
|
50 V
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare SM0402K2003JGBU with alternatives
Compare SM0402K2003JSFP with alternatives