SLG8SP533V
vs
9LPRS464AGLF
feature comparison
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
SILEGO TECHNOLOGY
|
INTEGRATED DEVICE TECHNOLOGY INC
|
Part Package Code |
QFN
|
TSSOP
|
Package Description |
9 X 9 MM, 0.50 MM PITCH, GREEN, MO-220WMMD, QFN-64
|
0.240 INCH, 0.020 INCH PITCH, ROHS COMPLIANT, MO-153, TSSOP-56
|
Pin Count |
64
|
56
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
JESD-30 Code |
S-PQCC-N64
|
R-PDSO-G56
|
Length |
9 mm
|
14 mm
|
Number of Terminals |
64
|
56
|
Operating Temperature-Max |
70 °C
|
70 °C
|
Operating Temperature-Min |
|
|
Output Clock Frequency-Max |
400 MHz
|
240 MHz
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
HVQCCN
|
TSSOP
|
Package Shape |
SQUARE
|
RECTANGULAR
|
Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
Primary Clock/Crystal Frequency-Nom |
14.318 MHz
|
14.318 MHz
|
Seated Height-Max |
0.84 mm
|
1.2 mm
|
Supply Voltage-Max |
3.465 V
|
3.465 V
|
Supply Voltage-Min |
3.135 V
|
3.135 V
|
Supply Voltage-Nom |
3.3 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
Terminal Form |
NO LEAD
|
GULL WING
|
Terminal Pitch |
0.5 mm
|
0.5 mm
|
Terminal Position |
QUAD
|
DUAL
|
Width |
9 mm
|
6.1 mm
|
uPs/uCs/Peripheral ICs Type |
CLOCK GENERATOR, PROCESSOR SPECIFIC
|
CLOCK GENERATOR, PROCESSOR SPECIFIC
|
Base Number Matches |
2
|
4
|
Pbfree Code |
|
Yes
|
Rohs Code |
|
Yes
|
Manufacturer Package Code |
|
PAG56
|
JESD-609 Code |
|
e3
|
Moisture Sensitivity Level |
|
1
|
Package Equivalence Code |
|
TSSOP56,.3,20
|
Peak Reflow Temperature (Cel) |
|
260
|
Qualification Status |
|
Not Qualified
|
Supply Current-Max |
|
180 mA
|
Terminal Finish |
|
MATTE TIN
|
Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare SLG8SP533V with alternatives
Compare 9LPRS464AGLF with alternatives