SI53102-A1-GM
vs
SI53102-A1-GMR
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Transferred
|
Transferred
|
Ihs Manufacturer |
SILICON LABORATORIES INC
|
SILICON LABORATORIES INC
|
Part Package Code |
DFN
|
DFN
|
Package Description |
TDFN-8
|
TDFN-8
|
Pin Count |
8
|
8
|
Reach Compliance Code |
compliant
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Samacsys Manufacturer |
Silicon Labs
|
Silicon Labs
|
Additional Feature |
ALSO OPERATES AT 3.3 V SUPPLY
|
ALSO OPERATES AT 3.3 V SUPPLY
|
Family |
53102
|
53102
|
Input Conditioning |
DIFFERENTIAL
|
DIFFERENTIAL
|
JESD-30 Code |
R-PDSO-N8
|
R-PDSO-N8
|
Length |
1.6 mm
|
1.6 mm
|
Logic IC Type |
LOW SKEW CLOCK DRIVER
|
LOW SKEW CLOCK DRIVER
|
Moisture Sensitivity Level |
2
|
|
Number of Functions |
1
|
1
|
Number of Inverted Outputs |
|
|
Number of Terminals |
8
|
8
|
Number of True Outputs |
4
|
4
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
HVSON
|
HVSON
|
Package Equivalence Code |
SOLCC8,.06,16
|
SOLCC8,.06,16
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
Peak Reflow Temperature (Cel) |
260
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Same Edge Skew-Max (tskwd) |
0.1 ns
|
0.1 ns
|
Seated Height-Max |
0.8 mm
|
0.8 mm
|
Supply Voltage-Max (Vsup) |
2.75 V
|
2.75 V
|
Supply Voltage-Min (Vsup) |
2.25 V
|
2.25 V
|
Supply Voltage-Nom (Vsup) |
2.5 V
|
2.5 V
|
Surface Mount |
YES
|
YES
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Form |
NO LEAD
|
NO LEAD
|
Terminal Pitch |
0.4 mm
|
0.4 mm
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
40
|
|
Width |
1.4 mm
|
1.4 mm
|
Base Number Matches |
2
|
1
|
|
|
|