SI4416DY/T3 vs FDS6690A feature comparison

SI4416DY/T3 NXP Semiconductors

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FDS6690A Fairchild Semiconductor Corporation

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Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer NXP SEMICONDUCTORS FAIRCHILD SEMICONDUCTOR CORP
Part Package Code SOIC SOIC
Package Description SMALL OUTLINE, R-PDSO-G8 SO-8
Pin Count 8 8
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
Configuration SINGLE WITH BUILT-IN DIODE SINGLE WITH BUILT-IN DIODE
DS Breakdown Voltage-Min 30 V 30 V
Drain Current-Max (ID) 0.009 A 11 A
Drain-source On Resistance-Max 0.018 Ω 0.0125 Ω
FET Technology METAL-OXIDE SEMICONDUCTOR METAL-OXIDE SEMICONDUCTOR
Feedback Cap-Max (Crss) 50 pF
JEDEC-95 Code MS-012AA
JESD-30 Code R-PDSO-G8 R-PDSO-G8
Number of Elements 1 1
Number of Terminals 8 8
Operating Mode ENHANCEMENT MODE ENHANCEMENT MODE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Polarity/Channel Type N-CHANNEL N-CHANNEL
Qualification Status Not Qualified Not Qualified
Surface Mount YES YES
Terminal Form GULL WING GULL WING
Terminal Position DUAL DUAL
Transistor Application SWITCHING SWITCHING
Transistor Element Material SILICON SILICON
Base Number Matches 1 3
Pbfree Code Yes
Rohs Code Yes
Manufacturer Package Code 8LD, JEDEC MS-012, .150"NARROW BODY
HTS Code 8541.29.00.95
Additional Feature LOGIC LEVEL COMPATIBLE
JESD-609 Code e3
Moisture Sensitivity Level 1
Operating Temperature-Max 150 °C
Operating Temperature-Min -55 °C
Peak Reflow Temperature (Cel) 260
Power Dissipation Ambient-Max 1 W
Power Dissipation-Max (Abs) 2.5 W
Terminal Finish MATTE TIN
Time@Peak Reflow Temperature-Max (s) 30

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