SF12Q9102DTLA vs RP73G2B91KDTN feature comparison

SF12Q9102DTLA Walsin Technology Corporation

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RP73G2B91KDTN TE Connectivity

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Part Life Cycle Code Active Active
Ihs Manufacturer WALSIN TECHNOLOGY CORP TE CONNECTIVITY LTD
Package Description CHIP
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8533.21.00.30
Additional Feature ANTI-SULFUR, LASER TRIMMABLE
Construction RECTANGULAR PACKAGE Chip
JESD-609 Code e3
Mounting Feature SURFACE MOUNT
Number of Terminals 2 2
Operating Temperature-Max 155 °C 155 °C
Operating Temperature-Min -55 °C -55 °C
Package Height 0.55 mm 0.6 mm
Package Length 3.05 mm 3.2 mm
Package Style SMT SMT
Package Width 1.55 mm 1.6 mm
Packing Method TR, Paper, 7 Inch TR
Rated Power Dissipation (P) 0.25 W 0.25 W
Rated Temperature 70 °C
Resistance 91000 Ω 91000 Ω
Resistor Type FIXED RESISTOR FIXED RESISTOR
Size Code 1206 1206
Surface Mount YES
Technology THIN FILM THIN FILM
Temperature Coefficient 50 ppm/°C 50 ppm/°C
Terminal Finish Matte Tin (Sn) - with Nickel (Ni) barrier
Terminal Shape WRAPAROUND
Tolerance 0.5% 0.5%
Working Voltage 200 V 200 V
Base Number Matches 1 1

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