SE556-1F/883B vs SE556-1CF feature comparison

SE556-1F/883B NXP Semiconductors

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SE556-1CF Signetics

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer SIGNETICS CORP SIGNETICS CORP
Part Package Code DIP
Package Description DIP, DIP14,.3 DIP, DIP14,.3
Pin Count 14
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature IT CAN ALSO OPERATE AT 15V NOM
Analog IC - Other Type PULSE
JESD-30 Code R-CDIP-T14 R-CDIP-T14
JESD-609 Code e0 e0
Number of Functions 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Output Frequency-Max 0.5 MHz
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
Package Code DIP DIP
Package Equivalence Code DIP14,.3 DIP14,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Qualification Status Not Qualified Not Qualified
Screening Level MIL-STD-883 Class B
Supply Voltage-Max (Vsup) 18 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO NO
Technology BIPOLAR BIPOLAR
Temperature Grade MILITARY MILITARY
Terminal Finish Tin/Lead (Sn/Pb) TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Base Number Matches 1 1

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