SE555CFK vs KA555I feature comparison

SE555CFK Texas Instruments

Buy Now Datasheet

KA555I Samsung Semiconductor

Buy Now Datasheet
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer TEXAS INSTRUMENTS INC SAMSUNG SEMICONDUCTOR INC
Part Package Code QLCC DIP
Package Description QCCN, LCC20,.35SQ 0.300 INCH, DIP-8
Pin Count 20 8
Reach Compliance Code not_compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Analog IC - Other Type PULSE; RECTANGULAR PULSE; RECTANGULAR
JESD-30 Code S-CQCC-N20 R-PDIP-T8
Length 8.89 mm 9.2 mm
Number of Functions 1 1
Number of Terminals 20 8
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Package Body Material CERAMIC, METAL-SEALED COFIRED PLASTIC/EPOXY
Package Code QCCN DIP
Package Equivalence Code LCC20,.35SQ DIP8,.3
Package Shape SQUARE RECTANGULAR
Package Style CHIP CARRIER IN-LINE
Peak Reflow Temperature (Cel) NOT SPECIFIED
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.03 mm 5.08 mm
Supply Voltage-Max (Vsup) 16 V 16 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 15 V
Surface Mount YES NO
Technology BIPOLAR BIPOLAR
Temperature Grade MILITARY INDUSTRIAL
Terminal Form NO LEAD THROUGH-HOLE
Terminal Pitch 1.27 mm 2.54 mm
Terminal Position QUAD DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 8.89 mm 7.62 mm
Base Number Matches 2 2
JESD-609 Code e0
Supply Current-Max (Isup) 15 mA
Terminal Finish Tin/Lead (Sn/Pb)

Compare SE555CFK with alternatives

Compare KA555I with alternatives