SCN68681E1F40 vs SCC2692AC1F28 feature comparison

SCN68681E1F40 YAGEO Corporation

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SCC2692AC1F28 NXP Semiconductors

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer PHILIPS COMPONENTS NXP SEMICONDUCTORS
Package Description , DIP,
Reach Compliance Code unknown unknown
HTS Code 8542.31.00.01 8542.31.00.01
Address Bus Width 4 4
Boundary Scan NO NO
Bus Compatibility S68000
Clock Frequency-Max 4 MHz 3.6864 MHz
Communication Protocol ASYNC, BIT; SYNC, BYTE; SYNC, HDLC; BISYNC; X.25; X.75; DDCMP; ADCCP ASYNC, BIT
Data Encoding/Decoding Method NRZ NRZ
Data Transfer Rate-Max 0.125 MBps 0.125 MBps
External Data Bus Width 8 8
JESD-30 Code R-CDIP-T40 R-GDIP-T28
Low Power Mode NO YES
Number of Serial I/Os 2 2
Number of Terminals 40 28
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, GLASS-SEALED
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max 5.5 V 5.25 V
Supply Voltage-Min 4.5 V 4.75 V
Supply Voltage-Nom 5 V 5 V
Surface Mount NO NO
Technology MOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position DUAL DUAL
uPs/uCs/Peripheral ICs Type SERIAL IO/COMMUNICATION CONTROLLER, SERIAL SERIAL IO/COMMUNICATION CONTROLLER, SERIAL
Base Number Matches 1 1
Length 37.15 mm
Number of DMA Channels
Number of I/O Lines 3
On Chip Data RAM Width
Package Code DIP
RAM (words) 0
Seated Height-Max 5.72 mm
Supply Current-Max 10 mA
Terminal Pitch 2.54 mm
Width 15.24 mm

Compare SCN68681E1F40 with alternatives

Compare SCC2692AC1F28 with alternatives