SCN68681E1F40
vs
SCC2692AC1F28
feature comparison
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
PHILIPS COMPONENTS
|
NXP SEMICONDUCTORS
|
Package Description |
,
|
DIP,
|
Reach Compliance Code |
unknown
|
unknown
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Address Bus Width |
4
|
4
|
Boundary Scan |
NO
|
NO
|
Bus Compatibility |
S68000
|
|
Clock Frequency-Max |
4 MHz
|
3.6864 MHz
|
Communication Protocol |
ASYNC, BIT; SYNC, BYTE; SYNC, HDLC; BISYNC; X.25; X.75; DDCMP; ADCCP
|
ASYNC, BIT
|
Data Encoding/Decoding Method |
NRZ
|
NRZ
|
Data Transfer Rate-Max |
0.125 MBps
|
0.125 MBps
|
External Data Bus Width |
8
|
8
|
JESD-30 Code |
R-CDIP-T40
|
R-GDIP-T28
|
Low Power Mode |
NO
|
YES
|
Number of Serial I/Os |
2
|
2
|
Number of Terminals |
40
|
28
|
Operating Temperature-Max |
85 °C
|
70 °C
|
Operating Temperature-Min |
-40 °C
|
|
Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, GLASS-SEALED
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
IN-LINE
|
IN-LINE
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Supply Voltage-Max |
5.5 V
|
5.25 V
|
Supply Voltage-Min |
4.5 V
|
4.75 V
|
Supply Voltage-Nom |
5 V
|
5 V
|
Surface Mount |
NO
|
NO
|
Technology |
MOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
Terminal Position |
DUAL
|
DUAL
|
uPs/uCs/Peripheral ICs Type |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL
|
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL
|
Base Number Matches |
1
|
1
|
Length |
|
37.15 mm
|
Number of DMA Channels |
|
|
Number of I/O Lines |
|
3
|
On Chip Data RAM Width |
|
|
Package Code |
|
DIP
|
RAM (words) |
|
0
|
Seated Height-Max |
|
5.72 mm
|
Supply Current-Max |
|
10 mA
|
Terminal Pitch |
|
2.54 mm
|
Width |
|
15.24 mm
|
|
|
|
Compare SCN68681E1F40 with alternatives
Compare SCC2692AC1F28 with alternatives