SCC68692E1F40
vs
SCC2692AE1F40
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
PHILIPS COMPONENTS
NXP SEMICONDUCTORS
Package Description
,
DIP,
Reach Compliance Code
unknown
unknown
HTS Code
8542.31.00.01
8542.31.00.01
Address Bus Width
4
4
Boundary Scan
NO
NO
Bus Compatibility
S68000
Clock Frequency-Max
4 MHz
3.6864 MHz
Communication Protocol
ASYNC, BIT; SYNC, BYTE; SYNC, HDLC; BISYNC; X.25; X.75; DDCMP; ADCCP
ASYNC, BIT
Data Encoding/Decoding Method
NRZ
NRZ
Data Transfer Rate-Max
0.125 MBps
0.125 MBps
External Data Bus Width
8
8
JESD-30 Code
R-CDIP-T40
R-GDIP-T40
Low Power Mode
NO
YES
Number of Serial I/Os
2
2
Number of Terminals
40
40
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, GLASS-SEALED
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Max
5.5 V
5.25 V
Supply Voltage-Min
4.5 V
4.75 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Position
DUAL
DUAL
uPs/uCs/Peripheral ICs Type
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL
Base Number Matches
1
1
Length
52.39 mm
Number of DMA Channels
Number of I/O Lines
15
On Chip Data RAM Width
RAM (words)
0
Seated Height-Max
5.72 mm
Supply Current-Max
10 mA
Terminal Pitch
2.54 mm
Width
15.24 mm
Compare SCC68692E1F40 with alternatives
Compare SCC2692AE1F40 with alternatives