SCC2692AE1F40
vs
SCC68692C1A44,529
feature comparison
All Stats
Differences Only
Rohs Code
No
Yes
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
PHILIPS SEMICONDUCTORS
NXP SEMICONDUCTORS
Package Description
DIP, DIP40,.6
QCCJ,
Reach Compliance Code
unknown
unknown
HTS Code
8542.31.00.01
8542.31.00.01
JESD-30 Code
R-CDIP-T40
S-PQCC-J44
JESD-609 Code
e0
e3
Number of Terminals
40
44
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
Package Body Material
CERAMIC, METAL-SEALED COFIRED
PLASTIC/EPOXY
Package Code
DIP
QCCJ
Package Equivalence Code
DIP40,.6
Package Shape
RECTANGULAR
SQUARE
Package Style
IN-LINE
CHIP CARRIER
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Nom
5 V
5 V
Surface Mount
NO
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Finish
Tin/Lead (Sn/Pb)
TIN
Terminal Form
THROUGH-HOLE
J BEND
Terminal Pitch
2.54 mm
1.27 mm
Terminal Position
DUAL
QUAD
uPs/uCs/Peripheral ICs Type
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL
Base Number Matches
3
1
Part Package Code
LCC
Pin Count
44
Manufacturer Package Code
SOT187-2
Address Bus Width
4
Boundary Scan
NO
Bus Compatibility
S68000
Clock Frequency-Max
4 MHz
Communication Protocol
ASYNC, BIT
Data Encoding/Decoding Method
NRZ
Data Transfer Rate-Max
0.125 MBps
External Data Bus Width
8
Length
16.5862 mm
Low Power Mode
YES
Moisture Sensitivity Level
3
Number of Serial I/Os
2
Seated Height-Max
4.57 mm
Supply Voltage-Max
5.5 V
Supply Voltage-Min
4.5 V
Width
16.5862 mm
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