SCC2691AC1A28,623
vs
SCC2691AC1A28
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
PHILIPS COMPONENTS
Part Package Code
LCC
Package Description
PLASTIC, MS-018, SOT-261-2, LCC-28
Pin Count
28
Manufacturer Package Code
SOT261-2
Reach Compliance Code
unknown
unknown
HTS Code
8542.31.00.01
8542.31.00.01
Address Bus Width
3
3
Boundary Scan
NO
NO
Clock Frequency-Max
4 MHz
4 MHz
Communication Protocol
ASYNC, BIT
ASYNC, BIT
Data Encoding/Decoding Method
NRZ
NRZ
Data Transfer Rate-Max
0.0046875 MBps
0.0046875 MBps
External Data Bus Width
8
8
JESD-30 Code
S-PQCC-J28
S-PQCC-J28
JESD-609 Code
e3
Length
11.505 mm
Low Power Mode
YES
NO
Moisture Sensitivity Level
1
Number of DMA Channels
Number of I/O Lines
1
Number of Serial I/Os
1
1
Number of Terminals
28
28
On Chip Data RAM Width
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
QCCJ
QCCJ
Package Shape
SQUARE
SQUARE
Package Style
CHIP CARRIER
CHIP CARRIER
Qualification Status
Not Qualified
Not Qualified
RAM (words)
0
Seated Height-Max
4.57 mm
Supply Current-Max
2 mA
Supply Voltage-Max
5.5 V
5.5 V
Supply Voltage-Min
4.5 V
4.5 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
TIN
Terminal Form
J BEND
J BEND
Terminal Pitch
1.27 mm
Terminal Position
QUAD
QUAD
Width
11.505 mm
uPs/uCs/Peripheral ICs Type
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL
Base Number Matches
1
3
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