SC28L198A1BE,551 vs SCC2698BE1A84,512 feature comparison

SC28L198A1BE,551 NXP Semiconductors

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SCC2698BE1A84,512 NXP Semiconductors

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Rohs Code Yes Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Part Package Code QFP LCC
Package Description LFQFP, QFP100,.63SQ,20 QCCJ, LDCC84,1.2SQ
Pin Count 100 84
Manufacturer Package Code SOT407-1 SOT189-2
Reach Compliance Code compliant compliant
HTS Code 8542.31.00.01 8542.31.00.01
Samacsys Manufacturer NXP NXP
Additional Feature ALSO OPERATES AT 3.3V SUPPLY
Address Bus Width 8 6
Boundary Scan NO NO
Clock Frequency-Max 8 MHz 4 MHz
Communication Protocol SYNC, HDLC; SYNC, SDLC; ADCCP ASYNC, BIT
Data Transfer Rate-Max 0.06103515625 MBps 0.125 MBps
External Data Bus Width 8 8
JESD-30 Code S-PQFP-G100 S-PQCC-J84
JESD-609 Code e3 e3
Length 14 mm 29.31 mm
Low Power Mode YES YES
Moisture Sensitivity Level 2 3
Number of Serial I/Os 8 8
Number of Terminals 100 84
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LFQFP QCCJ
Package Equivalence Code QFP100,.63SQ,20 LDCC84,1.2SQ
Package Shape SQUARE SQUARE
Package Style FLATPACK, LOW PROFILE, FINE PITCH CHIP CARRIER
Peak Reflow Temperature (Cel) 260 245
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.6 mm 4.57 mm
Supply Voltage-Max 5.5 V 5.25 V
Supply Voltage-Min 4.5 V 4.75 V
Supply Voltage-Nom 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish Tin (Sn) Tin (Sn)
Terminal Form GULL WING J BEND
Terminal Pitch 0.5 mm 1.27 mm
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) 30 30
Width 14 mm 29.31 mm
uPs/uCs/Peripheral ICs Type SERIAL IO/COMMUNICATION CONTROLLER, SERIAL SERIAL IO/COMMUNICATION CONTROLLER, SERIAL
Base Number Matches 1 1
Data Encoding/Decoding Method NRZ
Number of DMA Channels
Number of I/O Lines
On Chip Data RAM Width
RAM (words) 0
Supply Current-Max 30 mA

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