SC16IS760IPW
vs
935293393128
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
NXP SEMICONDUCTORS
Part Package Code
TSSOP
Package Description
4.40 MM, PLASTIC, MO-153, SOT355-1, TSSOP-24
HVQCCN,
Pin Count
24
Reach Compliance Code
compliant
unknown
HTS Code
8542.31.00.01
8542.31.00.01
Additional Feature
CAN ALSO OPERATES AT 2.5 V SUPPLY
CAN ALSO OPERATES AT 2.5 V SUPPLY
Address Bus Width
2
2
Boundary Scan
NO
NO
Clock Frequency-Max
80 MHz
80 MHz
Communication Protocol
ASYNC, BIT
ASYNC, BIT
Data Encoding/Decoding Method
NRZ
NRZ
Data Transfer Rate-Max
0.625 MBps
0.625 MBps
External Data Bus Width
JESD-30 Code
R-PDSO-G24
S-PQCC-N24
JESD-609 Code
e4
e4
Length
7.8 mm
4 mm
Low Power Mode
YES
YES
Moisture Sensitivity Level
1
Number of Serial I/Os
1
1
Number of Terminals
24
24
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSSOP
HVQCCN
Package Equivalence Code
TSSOP24,.25
Package Shape
RECTANGULAR
SQUARE
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Cel)
260
Qualification Status
Not Qualified
Seated Height-Max
1.1 mm
1 mm
Supply Voltage-Max
3.6 V
3.6 V
Supply Voltage-Min
3 V
3 V
Supply Voltage-Nom
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
Nickel/Palladium/Gold (Ni/Pd/Au)
NICKEL PALLADIUM GOLD
Terminal Form
GULL WING
NO LEAD
Terminal Pitch
0.65 mm
0.5 mm
Terminal Position
DUAL
QUAD
Time@Peak Reflow Temperature-Max (s)
30
Width
4.4 mm
4 mm
uPs/uCs/Peripheral ICs Type
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL
Base Number Matches
2
1
Compare SC16IS760IPW with alternatives
Compare 935293393128 with alternatives