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SC16IS760IPW vs SC16IS760IPW,112 feature comparison

SC16IS760IPW Philips Semiconductors

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SC16IS760IPW,112 NXP Semiconductors

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Rohs Code Yes Yes
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer PHILIPS SEMICONDUCTORS NXP SEMICONDUCTORS
Reach Compliance Code unknown compliant
HTS Code 8542.31.00.01 8542.31.00.01
JESD-30 Code R-PDSO-G24 R-PDSO-G24
Number of Terminals 24 24
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP TSSOP
Package Equivalence Code TSSOP24,.25 TSSOP24,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Qualification Status Not Qualified Not Qualified
Surface Mount YES YES
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form GULL WING GULL WING
Terminal Pitch 0.635 mm 0.65 mm
Terminal Position DUAL DUAL
uPs/uCs/Peripheral ICs Type SERIAL IO/COMMUNICATION CONTROLLER, SERIAL SERIAL IO/COMMUNICATION CONTROLLER, SERIAL
Base Number Matches 2 1
Part Package Code TSSOP2
Package Description 4.40 MM, PLASTIC, MO-153, SOT355-1, TSSOP-24
Pin Count 24
Manufacturer Package Code SOT355-1
Samacsys Manufacturer NXP
Additional Feature CAN ALSO OPERATES AT 2.5 V SUPPLY
Address Bus Width 2
Boundary Scan NO
Clock Frequency-Max 80 MHz
Communication Protocol ASYNC, BIT
Data Encoding/Decoding Method NRZ
Data Transfer Rate-Max 0.625 MBps
External Data Bus Width
JESD-609 Code e4
Length 7.8 mm
Low Power Mode YES
Moisture Sensitivity Level 1
Number of Serial I/Os 1
Peak Reflow Temperature (Cel) 260
Seated Height-Max 1.1 mm
Supply Voltage-Max 3.6 V
Supply Voltage-Min 3 V
Supply Voltage-Nom 3.3 V
Technology CMOS
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)
Time@Peak Reflow Temperature-Max (s) 30
Width 4.4 mm
Microcontrollers and Processors » Serial IO/Communication Controllers
Microcontrollers and Processors » Serial IO/Communication Controllers

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